Electric component for communication device and semiconductor device for switching transmission and reception

ABSTRACT

There are provided a transmission/reception switching circuit which is small in insertion loss and harmonic distortion and allows an increase in the output power of a power amplifier and an electronic component for communication on which the transmission/reception switching circuit is mounted. As an element composing a transmission/reception switching circuit in a wireless communication system, series-connected FETs or a multi-gate FET are used in place of a diode. Gate resistors connected between the individual gate terminals and a control terminal are designed to have resistance values which become progressively smaller from the gate to which a highest voltage is applied toward the gate to which a lowest voltage is applied.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese Patent ApplicationJP 2003-208960 filed on Aug. 27, 2003, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a technology which is effective whenapplied to a transmission/reception switching circuit in a wirelesscommunication system and further to the case where isolation between anantenna and a receiver circuit is thereby improved by reducing insertionloss. More particularly, the present invention relates to a technologywhich is effective when applied to a semiconductor integrated circuitformed with a transmission/reception switching circuit used in, e.g., amobile phone, to a front-end module on which the semiconductorintegrated circuit, a lowpass filter, an impedance matching circuit, andthe like are mounted, and further to an electronic component forcommunication such as a power module obtained by mounting a high-outputamplification circuit on the front-end module.

There have conventionally been dual band mobile phones each capable ofhandling signals in two frequency bands such as, e.g., a GSM (GlobalSystem for Mobile Communication) band ranging from 880 to 915 MHz and aDCS (Digital Cellular System) band ranging from 1710 to 1785 MHz. Inrecent years, there have also been demands for a triple band mobilephone capable of handling signals in, e.g., a PCS (PersonalCommunication System) band ranging from 1850 to 1915 MHz in addition tosignals in the GSM and DCS bands and for a quad band mobile phonecapable of handling signals in the EP GSM mode using a 800 MHz band andsignals in the US GSM mode using a 850 MHz.

A conventional mobile phone has typically been constituted by: anelectronic component termed a power module on which a semiconductorintegrated circuit (generally termed an RF IC) having the function ofup-converting and modulating a signal to be transmitted anddown-converting and demodulating a received signal, a semiconductorintegrated circuit (baseband IC) having the function of converting datato be transmitted to I and Q signals and restoring received data fromthe demodulated I and Q signals, an RF power amplifier and a biascircuit therefor, an impedance matching circuit, and the like aremounted; an electronic component termed a front end module on which atransmission/reception switching circuit, a lowpass filter, an impedancematching circuit, and the like are mounted; and the like.

Most of transmission/reception switching circuits used in conventionalmobile phones have used diodes to reduce insertion loss. As an exampleof the invention relating to a front end module on which a switchcircuit using a diode is mounted, there can be listed one disclosed inPatent Document 1. In the present specification, a plurality ofsemiconductor chips and discrete components which are mounted on aninsulating substrate, such as a ceramic substrate with printed wiringprovided on the surface or in the inside thereof, and which can behandled as if they compose a single electronic component with theindividual components being combined by the printed wiring and bondingwires to perform a specified function will be termed a module.

[Patent Document 1] Japanese Unexamined Patent Publication No.2003-051751

SUMMARY OF THE INVENTION

A transmission/reception switching circuit using a diode uses discretecomponents. Therefore, in a system requiring a plurality of diodes suchas a quad band system, a module on which it is mounted has the problemsof increased size and high current consumption particularly. In additionto a diode element, the transmission/reception switching circuit using adiode also requires a λ/4 microstrip line having a length ofapproximately 5 mm, which causes a further increase in the size of themodule.

To solve the problems, the present inventors have examined atransmission/reception switching circuit using a FET (field effecttransistor) in place of a diode. As a result, it was proved that thetransmission/reception switching circuit using a FET has the followingproblem. That is, if the level of a signal inputted to the source ordrain of the transistor in the OFF state is high in thetransmission/reception switching circuit using a FET, the input powerturns the transistor ON. Accordingly, the output power of a poweramplifier cannot be increased, while an output signal is distorted andthe quantities of harmonic components are thereby increased. A detaileddescription will be given herein below to the problem.

FIG. 11 shows a transmission/reception switch circuit using a HEMT (highelectron mobility transistor) examined by the present inventors. Thetransmission/reception switch circuit of FIG. 11 is constituted by: afirst switch transistor Q1 connected between a transmitter terminal Txconnected to the output terminal of a power amplifier and a commonterminal COM connected to an antenna; and a second switch transistor Q2connected between the common terminal COM connected to the antenna and areceiver terminal Rx to which the input terminal of a receiving circuitsuch as a low noise amplifier is connected. A dc voltage Vdc isconstantly applied to the transmitter terminal Tx and the receiverterminal Rx via respective inductors L1 and L2 such as choke coils.

As transistors Q1 and Q2, depletion-type HEMTs are used. Controlvoltages Vsw1 and Vsw2 are applied to the respective gate terminals viaresistance Rg1 and Rg2 and the dc voltage Vdc is applied to the sourceand drain terminals of each of the transistors Q1 and Q2. Accordingly,the transistors Q1 and Q2 are brought into the OFF state when thecontrol voltages Vsw1 and Vsw2 are switched to a LOW level such as aground potential GND (0 V), while they are brought into the ON statewhen the control voltages Vsw1 and Vsw2 are switched to a HIGH levelsuch as a power source voltage Vcc, though they are of depletion type.Specifically, in a transmission mode, the control voltage Vsw1 isswitched to the HIGH level and the control voltage Vsw2 is switched tothe LOW level so that the transistor Q1 is brought into the ON state andthe transistor Q2 is brought into the OFF state. In a reception mode,the control voltage Vsw1 is switched to the LOW level and the controlvoltage Vsw2 is switched to the HIGH level so that the transistor Q1 isbrought into the OFF state and the transistor Q2 is brought into the ONstate.

FIG. 12 shows a circuit equivalent to the transmission/reception switchcircuit in the transmission mode in which the transistor Q1 is broughtinto the ON state and the transistor Q2 is brought into the OFF state.In the transmission mode, the transistor Q1 is represented by asource-drain resistance Ron1, by a gate-source capacitance Cgs1, and bya gate-drain capacitance Cgd1, as shown in FIG. 12. Ron1 represents theon-resistance (channel resistance) of the transistor Q1. On the otherhand, the transistor Q2 is represented by a source-drain capacitanceCds2, a gate-source capacitance Cgs2, and a gate-drain capacitance Cgd2.Characteristics required in the transmission mode are a small insertionloss between the transmitter terminal Tx and the common terminal COMconnected to the antenna and high isolation between the common terminalCOM connected to the antenna and the receiver terminal Rx.

In general, the channel resistance Ron1 of the FET in the ON state islow (1 Ω or less) so that an insertion loss resulting from thetransistor Q1 is also low (0.5 dB or less) Accordingly, an output to betransmitted from a power amplifier which has been inputted to thetransmitter terminal Tx passes through the resistance Ron1 and isconveyed with a low loss to the common terminal COM connected to theantenna. In the case of an RF signal, however, the signal may leak viathe gate-source capacitance Cgs1 of the transistor Q1 shown in FIG. 12so that an increase in insertion loss resulting from signal leakage issuppressed by providing a gate resistor Rg1 of about 10 kΩ. Thearrangement allows low-loss conveyance of the output to be transmittedfrom the power amplifier to the common terminal COM connected to theantenna via the transistor Q1 so that, in the case of the switch circuitof FIG. 11, the output to be transmitted from the power amplifier isalso inputted directly to the transistor Q2. As a result, the isolationcharacteristic of the transistor Q2 defines a maximum permissible inputpower.

FIG. 13 shows the waveform (i) of an RF voltage applied to thegate-source capacitance Cgs2 when the transistor Q2 composing the switchcircuit of FIG. 11 is in the OFF state and the waveform (ii) of an RFvoltage applied to the gate-source capacitance Cgs1 when the transistorQ1 is in the ON state. In the transmission mode, the source-drainresistance Ron1 of the transistor Q1 in the ON state is low (1 Ω orless) so that the difference between a source potential and a drainpotential is small. Accordingly, the waveform (i) of the RF voltageapplied to the gate-source capacitance Cgs1 of the transistor Q1 has asmall amplitude.

By contrast, the source and drain of the transistor Q2 in the OFF stateare coupled to each other via a capacitance, while a signal at anantenna terminal changes by using the dc voltage Vdc as a bias point and0 V is applied to the gate terminal of the transistor Q2. Accordingly,if the center potential of the waveform (ii) of the RF voltage appliedto the gate-source capacitance Cgs1 of the transistor Q1 is assumed tobe “0”, such an RF voltage as has the waveform (i) centering around avalue of −Vdc and having an amplitude of 2 (|Vdc|−|Vth|) is applied tothe gate-source capacitance Cgs2 of the transistor Q2 in the OFF state.Here, Vth represents the threshold voltage of each of the transistors Q1and Q2 so that, if a voltage higher than a value given by |Vdc|−|Vth| isapplied between the gate and source of the transistor Q2, the transistorQ2 is turned ON and an RF signal conveyed to the antenna terminal viathe transistor Q1 leaks to the receiver terminal Rx.

Accordingly, the amplitude of the maximum permissible input power in theswitch circuit of FIG. 11 becomes 2 (|Vdc|−|Vth|). If the poweramplifier outputs an RF signal of a power higher than this, theinsertion loss of the switch circuit is increased accordingly andharmonics are generated. Although it is possible to increase theamplitude of the maximum permissible input power if the thresholdvoltage Vth of each of the transistors Q1 and Q2 is reduced, theon-resistance Ron is increased if the threshold voltage Vth is reducedand the insertion loss is thereby increased, so that a reduction inthreshold voltage Vth is not preferred.

It is therefore an object of the present invention to provide atransmission/reception switching circuit which can be reduced in sizeand current consumption by reducing the number of components composing asystem and a module and thereby increasing the mounting density andprovide an electronic component for communication on which thetransmission/reception switching circuit is mounted. Another object ofthe present invention is to provide a transmission/reception switchingcircuit which is small in insertion loss and harmonic distortion andprovide an electronic component for communication on which thetransmission/reception switching circuit is mounted.

Still another object of the present invention is to provide atransmission/reception switching circuit which allows an increase in theoutput power of the power amplifier and an electronic component forcommunication on which the transmission/reception switching circuit ismounted.

The above and other objects and novel features of the present inventionwill become apparent from the description of the present specificationand the accompanying drawings.

The following is a brief description given to the outline of therepresentative aspects of the present invention disclosed in the presentapplication.

Specifically, FETs connected in series or a multi-gate FET is used inplace of a diode as an element composing a transmission/receptionswitching circuit in a wireless communication system such that theresistance values of gate resistors connected between individual gateterminals and a control terminal become progressively lower in adirection from the gate to which a highest voltage is applied toward thegate to which a lowest voltage is applied. Alternatively, in a switchcircuit composed of a first transistor connected between a transmitterterminal to which a signal to be transmitted is inputted and a terminalconnected to an antenna and a second transistor connected between theterminal connected to the antenna and a receiver terminal for supplyinga received signal to a reception circuit, a dc voltage for biasing isapplied preferably to each of the transmitter terminal and the terminalconnected to the antenna.

With the foregoing means, the number of components composing the systemand a module can be reduced and the mounting density can be increased byusing the FET or FETs in place of a diode as an element composing theswitch circuit. By progressively reducing the resistance values of thegate resistors in the direction from the gate to which a highest voltageis applied toward the gate to which a lowest voltage is applied, itbecomes possible to circumvent the situation in which the FET to which ahigher voltage is inputted is brought into the ON state earlier, reduceinsertion loss, and thereby reduce harmonic distortion. By applying a dcvoltage for biasing to each of the transmitter terminal and the terminalconnected to the antenna, the maximum permissible power of an RF signalinputted to the transmitter terminal can be increased.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram showing a structure of a first embodiment ofa transmission/reception switch circuit according to the presentinvention;

FIG. 2 is a circuit diagram showing a structure of a second embodimentof the transmission/reception switch circuit according to the presentinvention;

FIG. 3 is a circuit diagram showing a structure of an example of atransmission/reception switch circuit examined by the present inventors;

FIG. 4 is a circuit diagram showing a structure of a third embodiment ofthe transmission/reception switch circuit according to the presentinvention;

FIG. 5 is a circuit diagram showing a structure of a fourth embodimentof the transmission/reception switch circuit according to the presentinvention;

FIG. 6 is a block diagram showing a schematic structure of a preferredembodiment of a module composed of the transmission/reception switchcircuit according to the present invention, a power amplifier, and alowpass filter;

FIG. 7 is a block diagram showing a schematic structure of a secondembodiment of the module composed of the transmission/receptionswitching circuit according to the present invention, the poweramplifier, and the lowpass filter and that of a wireless communicationsystem using the module;

FIG. 8 is a plan view showing a layout structure of an entire SWICaccording to an embodiment;

FIG. 9 is a plan view showing a layout obtained by enlarging the portioninside an enclosure denoted by a reference numeral A in FIG. 8;

FIG. 10A to 10C are cross-sectional views taken along the line A-A ofFIG. 9 and illustrating individual fabrication steps in the order theyare performed;

FIG. 11 is a circuit diagram showing a structure of atransmission/reception switch circuit using a HEMT (high electronmobility transistor) examined by the present inventors;

FIG. 12 is an equivalent circuit diagram of the transmission/receptionswitch circuit in a transmission mode in which the transistor Q1 and Q2of FIG. 11 are brought into and ON state and an OFF state, respectively;and

FIG. 13 is a view illustrating the waveform (i) of an RF voltage appliedto a gate-source capacitance Cgs2 when a transistor Q2 composing theswitch circuit of FIG. 11 is in the OFF state and the waveform (ii) ofan RF voltage applied to a gate-source capacitor Cgs1 when thetransistor Q2 is in the ON state.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 shows a first embodiment of a transmission/reception switchcircuit according to the present embodiment. The transmission/receptionswitch circuit of the present embodiment is formed as a semiconductorintegrated circuit on a semiconductor substrate such as a GaAs chip.

The transmission/reception switch circuit of the present embodimentcomprises: a first switch transistor Q1 connected between a transmitterterminal Tx connected to the output terminal of a power amplifier and acommon terminal COM connected to an antenna; and a second switchtransistor Q2 connected between the foregoing common terminal COM and areceiver terminal Rx to which the input terminal of a receiving circuitsuch as a low noise amplifier is connected. A dc voltage Vdc is appliedto the foregoing transmitter terminal Tx and common terminal COM viarespective external resistors Rd1 and Rd2.

As the transistors Q1 and Q2, depletion-type P-channel HEMTs are used.Each of the transistors Q1 and Q2 is formed as a triple gate element inwhich three gate electrodes are formed relative to one channel. Acontrol voltage Vsw1 is applied to the gate electrodes of the transistorQ1 via respective resistors R11, R12, and R13, while a control voltageVsw2 is applied to the gate electrodes of the transistor Q2 viarespective resistors R21, R22, and R23. Since the dc voltage Vdc hasbeen applied to the source terminal of each of the transistors Q1 andQ2, the transistors Q1 and Q2 are brought into the OFF state when thecontrol voltages Vsw1 and Vsw2 are switched to a LOW level such as aground potential GND (0 V), while they are brought into the ON statewhen the control voltages Vsw1 and Vsw2 are switched to a HIGH levelsuch as a power source voltage Vcc, though they are of depletion type.

Specifically, in a transmission mode, the control voltage Vsw1 isswitched to the HIGH level and the control voltage Vsw2 is switched tothe LOW level so that the transistor Q1 is brought into the ON state andthe transistor Q2 is brought into the OFF state. In a reception mode,the control voltage Vsw1 is switched to the LOW level and the controlvoltage Vsw2 is switched to the HIGH level so that the transistor Q1 isbrought into the OFF state and the transistor Q2 is brought into the ONstate.

Although the resistors Rd1 and Rd2 are composed of external resistors inthe present embodiment, it will easily be understood that they may alsobe composed of on-chip resistors. Instead of the resistors Rd1 and Rd2,inductors such as choke coils may also be used. However, the use of theresistors facilitates the implementation of an on-chip configuration,achieves a reduction in the number of components, and allows the scalingdown of the system. As the resistance values of the resistors Rd1 andRd2 are larger, it becomes possible to more reliably prevent the leakageof an RF component to signal lines for supplying the control voltagesVsw1 and Vsw2 and an increase in insertion loss. However, excessivelylarge resistance values cause a slow switching response so that it isset to fall within the range of 5 kΩ to 20 kΩ.

In the present embodiment, the respective resistance values r11, r12,and r13 of the gate resistors R11, R12, and R13 for the transistor Q1have been set to satisfy, e.g., r11=3×r13 and r12=2×r13 such thatr11>r12>r13 is established. Likewise, the respective resistance valuesr21, r22, and r23 of the gate resistors R21, R22, and R23 for thetransistor Q2 have also been set to satisfy r21>r22>r23, e.g., r21=3×r23and r22=2×r23. Here, a value such as 5 kΩ is selected for each of r13and r23.

Although the source-drain resistance is slightly higher than in thecircuit of FIG. 1, the transmission/reception switch circuit may beconstituted by a switch composed of three HEMTs Q21, Q22, and Q23connected in series such that the respective resistance values r21, r22,and r23 of the gate resistors R21, R22, and R23 satisfy a relationshipgiven by, e.g., r21:r22:r23=3:2:1 and by a switch (the depiction thereofis omitted) composed of three transistors Q11, Q12, and Q13 connected inseries such that the respective resistance values r11, r12, and r13 ofthe gate resistors R11, R12, and R13 similarly satisfy a relationshipgiven by, e.g., r11:r12:r13=3:2:1, as shown in FIG. 2.

In a transmission/reception switch circuit using a switch as shown inFIG. 3 which is composed of the transistors Q21, Q22, and Q23 eachhaving the same structure as shown in FIG. 2 and connected in threestages such that the respective gate resistors therefor have the sameresistance value and in which a bias voltage Vdc is applied to thereceiver terminal Rx via the resistor Rd2 and a switch (a bias powersupply point therefor is the transmitter terminal Tx) similarly composedof transistor Q11, Q12, and Q13 connected in three stages such that therespective gate resistors therefor have the same resistance value,potentials Vd1, Vd2, and Vd3 at the respective nodes Nd1, Nd2, and Nd3closer to the sources of the transistors Q21, Q22, and Q23 in the OFFstate (Vsw2=0 V) satisfy Vd1>Vd2>Vd3 so that currents Ig1, Ig2, and Ig3flowing from the sources to the gates satisfy Ig1>Ig2>Ig3.

Accordingly, the gate-source voltages Vgs1, Vgs2, and Vgs3 of thetransistors Q21, Q22, and Q23 satisfy Vgs1>Vgs2>Vgs3. As a result, whensuch an RF voltage Vin as has the waveform (i) shown in FIG. 13 isapplied to the source of the transistor Q21 closer to the antennaterminal, the gate-source voltage Vgs1 reaches a turn-on voltage(|Vdc|−↑Vth|) and shifts to the ON state earlier than in the othertransistors Q22 and Q23. As a result, the maximum permissible inputvoltage of the switch circuit when the transistors Q21, Q22, and Q23 arein the OFF state does not increase so much.

By contrast, if a switch as shown in FIG. 2 is used, the respectivevalues r21, r22, and r23 of the gate resistors R21, R22, and R23 havebeen set to satisfy a relationship given by r21:r22:r23=3:2:1. As aresult, the currents Ig1, Ig2, and Ig3 flow in the gate resistors R21,R22, and R23 so that the respective voltages at the gate electrodes ofthe transistors Q21, Q22, and Q23 become progressively lower in theorder of the transistors Q21, Q22, and Q23 due to a voltage drop, whilethe gate-source voltages Vgs1, Vgs2, and Vgs3 of the transistors Q21,Q22, and Q23 become substantially the same. This circumvents thesituation in which the transistor Q21 close to the antenna terminal isbrought into the ON sate earlier than the other transistors Q22 and Q23so that the maximum permissible input voltage is increased. This mayalso hold true for the switch circuit of FIG. 1 using a triple gate HEMTas a switching transistor.

In the transistors Q11, Q12, and Q13 which are brought into the ON stateduring transmission also, the inputted RF voltage Vin is divided betweenthe source and drain of each of the transistors Q11, Q12, and Q13 andthe gate-source voltage Vgs1, Vgs2, and Vgs3 satisfy Vgs1>Vgs2>Vgs3.Accordingly, if the gate resistances are the same, the gate-sourcevoltage of the transistor Q11 closest to the transmitter terminal Txexceeds, earliest of all, a voltage Vbi termed a built-in potential atwhich a current in a positive direction brings to flow in the gate whenthe RF voltage indicated by the waveform (ii) of FIG. 13 increases andlarge quantities of harmonic components are generated.

By contrast, by adjusting the ratio among the resistance values r11,r12, and r13 of the gate resistors R11, R12, and R13 to 3:2:1 as in theembodiment, the gate-source voltages Vgs1, Vgs2, and Vgs3 of thetransistors Q11, Q12, and Q13 become substantially the same. Thiscircumvents the situation in which a current begins to flow earliest inthe gate of the transistor Q11 closest to the transmitter terminal Tx.This also holds true for the switch circuit of FIG. 1 using the triplegate HEMT as the switching transistor. Since the resistance value of thegate resistor of the transistor on the side on which the RF power isinputted has thus been adjusted to be larger in each of the switchingcircuit according to the embodiment of FIG. 1 and the switching circuitaccording to the embodiment of FIG. 2, the maximum permissible inputvoltage can be set to a value larger than in a switching circuit asshown in FIG. 11.

In addition, the switch circuit of FIG. 1 using the triple gate HEMT isadvantageous over the switching circuit of FIG. 2 in which the thirdtransistors are connected in series in that the channel is shorterbecause there is no region in which a source electrode and a drainelectrode are provided midway and that the on-resistance Ron can bereduced because there is no source resistor and no drain resistor, whichachieves a reduction in insertion loss. Further, the switching circuitsaccording to the embodiments of FIGS. 1 and 2 are advantageous in thatharmonic distortion can be reduced because the bias voltage Vdc forgiving the operating point of the RF signal has been applied to theterminal of each of the transistors Q1 and Q2 to which the RF power isinputted.

Although it is conceivably possible to use the terminal opposite to theterminal of the transistor Q2 to which the RF power is inputted as apoint to which the bias voltage Vdc is applied, as shown in FIG. 11, thearrangement involves the possibility that, due to the non-linearity ofthe gate-source capacitance Cgs2 of the transistor Q2, the operatingpoint of the RF signal (the waveform (i) of FIG. 13) shifts as indicatedby the arrow X in FIG. 13 to exceed the line of the threshold voltageVth and increase the harmonic distortion. By contrast, in each of theswitching circuits according to the embodiments of FIGS. 1 and 2, thebias voltage Vd has been applied to the terminal of the transistor Q2 towhich the RF power is inputted so that the harmonic distortion isreduced.

Likewise, it is also possible to use, in the transistor Q1, the commonterminal COM connected to the antenna on the other side, not thetransmitter terminal Tx, as the point to which the bias voltage Vdc isapplied. However, the arrangement involves the possibility that, due tothe non-linearity of the on-resistance Ron of the transistor Q1, theoperating point of the RF signal (the waveform (ii) of FIG. 13) shiftsas indicated by the arrow Y in FIG. 13 to cause operation in a regionwhere a drain current characteristic is not linear and increase theharmonic distortion. By contrast, since the bias voltage Vdc has beenapplied to the transmitter terminal Tx of the transistor Q1 to which theRF power is inputted in each of the switching circuits according to theembodiments of FIGS. 1 and 2, the harmonic distortion can be reduced.

FIG. 4 shows a third embodiment of the transmission/reception switchcircuit according to the present invention.

In this embodiment, a switching transistor Q3 is provided between thecommon terminal COM connected to the antenna and a second receiverterminal Rx2 to be in parallel with the switching transistor Q2 in theembodiment of FIG. 1. The transistor Q3 is composed of a triple gateHEMT, similarly to the transistor Q2. The ratio among the resistancevalues r31, r32, and r33 of resistors R31, R32, and R33 connected to thegates has been set to 3:2:1. The switching circuit of this embodiment isused conveniently to compose a system capable of transmitting andreceiving signals in two different frequency bands, such as signals inthe GSM mode and signals in the DCS mode.

FIG. 5 shows a fourth embodiment of the transmission/reception switchcircuit according to the present invention.

In this embodiment, switching transistors Q3 and Q4 in a parallelconfiguration are provided between the switching transistor Q2 in theembodiment of FIG. 1 and the first receiver terminal Rx1 and between theswitching transistor Q2 and the second receiver terminal Rx2 to furtherenhance isolation at the receiver. Each of the transistors Q3 and Q4 iscomposed of a double-gate HEMT. The resistance values r31, r32, r41, andr42 of the resistances R31, R32, R41, and R42 have been set to satisfyr31≧r32 and r41≧r42. The switching circuit of this embodiment is alsoused conveniently to compose a system capable of transmitting andreceiving signals in two different frequency bands such as signals inthe GSM mode and signals in the DCS mode.

FIG. 6 shows a schematic structure of a preferred embodiment of a modulecomposed of the transmission/reception switching circuit according tothe present invention, a power amplifier, and a lowpass filter.

The module according to this embodiment comprises: a switch circuit(SWIC) 110 formed into a semiconductor integrated circuit; a poweramplifier 121 for amplifying DCS signals at 1800 MHz to be transmittedand PCS signals at 1900 MHz to be transmitted; a power amplifier 122 foramplifying GSM signals at 800 MHz to 850 MHz to be transmitted; acontrol circuit 130 for generating signals for controlling the gains ofthe power amplifiers 121 and 122 and signals for ON/OFF control of aswitch in the SWIC 110; lowpass filters 141 and 142 for removingharmonics from RF signals amplified by the power amplifiers 121 and 122;a demultiplexer 150 for separating DCS and PCS transmitted/receivedsignals from GSM transmitted/received signals; and the like, which aremounted on a ceramic substrate 100 composed of a plurality of stackeddielectric layers each made of alumina or the like and having wires ormicrostrip lines each composed of a conductive layer formed on the topand back surfaces thereof.

The SWIC 110 is composed of two switch circuits as used in theembodiment of FIG. 4 or FIG. 5 which are formed on a singlesemiconductor chip. The widths of the respective gate electrodes of theswitches have been designed such that the gate width of the transistorQ1 composing the GSM switch circuit SW2 is larger than the gate width ofthe transistor Q1 composing the DCS/PCD switch circuit SW1. A GSMmaximum output power is 36 dB, while a DCS/PCS maximum output power is34 dB. This is because, since the GSM maximum output power is higher,the GSM switch circuit and the DCS/PCD switch circuit do not have thesame insertion loss unless the gate widths are set as described above.Instead of changing the gate widths of the transistors composing theswitch circuits SW1 and SW2, it is also possible to change the number ofgates in the transistor Q1. Specifically, the number of the gates in thetransistor Q1 of the GSM switch circuit SW2 is adjusted to be smaller.The gate widths of the transistors Q2 in the GSM switch circuit SW2 andin the DCS/PCD switch circuit SW1 are determined by a tradeoff betweeninsertion loss and receiver isolation.

Each of the power amplifiers 121 and 122 and the control circuit 130 iscomposed of a single or a plurality of semiconductor chips. Each of thelowpass filters 141 and 142 is composed of a resistor formed of aconductor layer on the ceramic substrate 100 and a capacitance betweenconductor layers or composed of a resistor element and a capacitorelement mounted on the substrate. An impedance matching circuit composedof a microstrip line and an interlayer capacitance is provided betweenthe power amplifiers 121 and 122 and the lowpass filters 141 and 142,though it is not depicted. A bias voltage Vdc is applied to the commonterminals COM1 and COM2 of the SWIC 100 via external resistors Rd2l andRd22, respectively. Likewise, the bias voltage Vdc is also applied tothe transmitter terminals Tx1 and Tx2, though it is not depicted. Thedemultiplexer 150 is composed of a highpass filter HFT which allows thepassage of DCS and PCS transmitted/received signals therethrough and alowpass filter LFT which allows the passage of GSM transmitted/receivedsignals therethrough.

Outside the module of this embodiment, an antenna ATN is connected tothe demultiplexer 150, while low noise amplifiers 221 to 224 foramplifying received signals are connected to the receiver terminals Rx1,Rx2, Rx3, and Rx4 of the SWIC 110 via bandpass filters 211 to 214 eachcomposed of a SAW filter. The low noise amplifiers 221 to 224 can beformed into a single semiconductor integrated circuit (termed an RF IC)together with a modulation circuit for modulating a signal to betransmitted, a mixer for performing up-conversion, a demodulationcircuit for demodulating a received signal, a mixer for performingdown-conversion, and the like.

The control circuit 130 generates a signal for controlling the gains ofthe power amplifiers 121 and 122 based on an output level indicationsignal Vramp supplied from a baseband circuit for generating I and Qsignals based on data to be transmitted (a baseband signal) andgenerating the baseband signal from the demodulated I and Q signals andgenerates transmission/reception switch voltages Vsw1 and Vsw2 for theswitch circuits in the SWIC 110 based on a signal indicative of a mode.The baseband circuit can be constructed as a semiconductor integratedcircuit (IC) on a single semiconductor chip.

It has generally been known that the impedance of a transmission linediffers depending on the frequency of a signal transmitted by thetransmission line. In the embodiment of FIG. 6, therefore, the length ofa line (microstrip line) L2 from the lowpass filter 142 to the SWIC 110has been set to be larger than (about double) the length of a line L1from the lowpass filter 141 to the SWIC 110 such that the impedance ofthe line L1 matches the impedance of the line L2. This is because a GSMsignal propagated by the line L2 has a frequency lower (about ½) thanthe frequencies of a DCS signal (1800 MHz) and a PCS signal (1900 MHz).In general, a line on a printed substrate is mostly designed to have ashortest distance propagate by the line L1. In this embodiment,therefore the line L2 is disposed in a meandering configuration to havea path more redundant than the path of the line L1 or, alternatively,the lowpass filter 142 is disposed at a position farther away from theSWIC 110 than the lowpass filter 141.

FIG. 7 shows a schematic structure of a second embodiment of the modulecomposed of the transmission/reception switching circuit according tothe present invention, the power amplifier, and the lowpass filter andthat of a wireless communication system using the module. In FIG. 7, thesame circuits as shown in FIG. 6 will be denoted by the same referencenumerals and the repeated description thereof will be omitted.

In contrast to the module of the embodiment of FIG. 6 constructed to becapable of transmitting/receiving signals in four frequency bands, themodule of the embodiment of FIG. 7 is constructed to be capable oftransmitting/receiving signals in two frequency bands such as, e.g., GSMsignals and DCS signals. The embodiment of FIG. 7 uses, as the SWIC 110,two switch circuits as used in the embodiment of FIG. 1 in a parallelconfiguration and the common terminal COM connected to the antenna andconnected commonly to the two switch circuits, which are formed on asingle semiconductor chip. In other words, the embodiment of FIG. 7 usesthe switch circuit of FIG. 4 provided with two transmitter terminals Txand a triple gate transistor provided between the second transmitterterminal Tx2 and the common terminal COM to be in parallel with thetransmitter transistor Q1, which are formed on the semiconductor chip.

An RF signal modulated by a mixer 240 for modulation & up-conversionwhich modulates a signal transmitted from an RF oscillator 230 based onthe I and Q signals inputted from a baseband circuit 300 is inputted tothe power amplifiers 121 and 122. Received signals amplified by lownoise amplifiers 221 and 222 are supplied to a mixer 250 fordemodulation & up-conversion where they are demodulated. The demodulatedI and Q signals are supplied to the baseband circuit 300 where they areprocessed. The RF oscillator 230 and the mixers 240 and 250 are formedas a semiconductor integrated circuit (RF IC) 200 on a singlesemiconductor chip.

Also in the embodiment of FIG. 7, the length of the line (microstripline) L2 from the lowpass filter 142 to the SWIC 110 has also been setto be larger than that of the line L1 from the lowpass filter 141 to theSWIC 110.

A description will be given next to an embodiment of a device structurewhen the switch circuit (SWIC 100) of the foregoing embodiment is formedon a semiconductor chip with reference to FIGS. 8 to 10.

FIG. 8 shows a layout structure of the entire SWIC 100 according to theembodiment. FIG. 9 shows a layout obtained by enlarging the portioninside the enclosure denoted by a reference numeral A in FIG. 8. TheSWIC 100 shown in FIG. 8 is obtained by constructing the switch circuithaving the single transmitter terminal Tx and the single receiverterminal Rx shown in FIG. 1 as the semiconductor integrated circuit.

In FIG. 8, a reference numeral P1 denotes a bonding pad as thetransmitter terminal Tx, P2 denotes a bonding pad as the common terminalCOM, P3 denotes a bonding pad as the receiver terminal Rx, and P4 and P5denote bonding pads to which the ON/OFF control voltages Vsw1 and Vsw2for switch transistors Q1 and Q2 are inputted. On the other hand, areference numeral L11 denotes a line composed of a conductive layer madeof aluminum or the like and connected to the bonding pad P1 as thetransmitter terminal Tx, L12 denotes a line connected to the bonding padP2 as the common terminal COM, and L13 denotes a line connected to thebonding pad P3 as the receiver terminal Rx.

A transistor formation region TAR1 formed with the positive layer,carrier supply layer, and contact layer of the switch transistor Q1, thesource/drain electrodes thereof connected to the contact layer, the gateelectrode thereof provided between the source/drain electrodes, and thelike is provided on a portion of the surface of the semiconductor chiplocated between the lines L11 and L12. In addition, a transistorformation region TAR2 formed with the positive layer, carrier supplylayer, and contact layer of the switch transistor Q2, the source/drainelectrodes thereof connected to the contact layer, the gate electrodethereof provided between the source/drain electrodes, and the like isprovided on a portion of the surface of the semiconductor chip locatedbetween the lines L12 and L13. Further, resistor formation regions PAR1and PAR2 formed with resistor layers serving as the gate resistors R11to R13 of the transistor Q1 and the gate resistors R21 to R23 of thetransistor Q2 are formed sidewise (on the right side of the drawing) ofthese transistors Q1 and Q2.

As shown in enlarged relation in FIG. 9, the gate resistors R11 to R13and R21 to R23 formed in the resistor formation regions RAR1 and RAR2are composed of resistor layers MR1 to MR6 made of WSiN (tungstensilicide) set to a specified length or the like in the presentembodiment. Specifically, the gate resistors R13 and R23 each having asmallest resistance value are composed of the single resistor layer MR1,the gate resistors R12 and R22 each having a resistance value double theresistance values of the gate resistors R13 and R23 are composed of thetwo resistor layers MR2 and MR3, and the gate resistors R11 and R21 eachhaving a resistance value triple the resistance values of the gateresistors R13 and R23 are composed of the three resistor layers MR4 toMR6, respectively. The resistor layers MR1 to MR6 are designed to havethe same length and the same resistance value. In the case of using aplurality of resistor layers such as the gate resistors R11, R21, R12,and R22, the individual resistor layers are connected in series byinterconnect layers M1 to M4.

In the transistor formation region TAR1, the source electrodes S1, S2, .. . are formed in a comb-shaped configuration in a direction from theline L11 toward the line L12 and the drain electrodes D1, D2, . . . areformed in a comb-shaped configuration in a direction from the line L12toward the line L11. Between these electrodes, metal layers GM1, GM2,and GM3 serving as the gate electrodes are arranged in mutually paralleland meandering relation.

A description will be given next to an example of a cross-sectionalstructure of the switch transistors Q1 and Q2 composing the SWIC and thegate resistors R11 to R23 and a fabrication method therefor withreference to FIG. 10A to 10C which are cross-sectional views taken alongthe line A-A′ of FIG. 9 and illustrating individual fabrication steps inthe order they are performed.

First, in the same manner as in a normal HEMT fabrication process, aGaAs epitaxial layer 121, a GaAs layer 122 serving as an operatinglayer, an AlGaAs layer 123 serving as a carrier supply layer, and ann-GaAs layer 124 serving as a low-resistance contact layer are formedsuccessively on a semiconductor insulating GaAs substrate 120. Then, theportion except for the transistor formation region is etched away and aninsulating film 131 composed of a PSG film and an SiO film is formed.Subsequently, a WSiN film is formed on the insulating film 131 and thenpatterned to form a resistor layer 141 serving as gate resistors so thatthe state shown in FIG. 10A is reached.

Thereafter, openings are formed in the portion of the insulating film131 located over the transistor formation region by selective etching.Then, metal layers 151 and 152 serving as source/drain electrodes areformed in the openings so that the state shown in FIG. 10B is reached.Subsequently, the respective portions of the insulating film 131 and then-GaAs layer 124 located between the metal layers 151 and 152 areselectively etched such that three openings are formed. A metal layer153 serving as the gate electrodes in contact with the AlGaAs layer 123is formed in each of the three openings so that the state shown in FIG.10C is reached.

Although the specific description has been given thus far to theembodiments of the invention achieved by the present inventors, thepresent invention is not limited to the foregoing embodiments. It willeasily be appreciated that various modifications and changes can be madewithout departing from the gist thereof.

For example, although the foregoing embodiments have applied the dcvoltage Vdc which gives a bias point to each of the transmitter terminalTx and the common terminal COM via the resistor, it is also possible toapply the dc voltage Vdc via an inductor such as a choke coil. In thatcase, the inductor may also be composed of an external element or anon-chip element formed on the same chip on which the transistors Q1 andQ2 are formed.

Although the dual gate transistors Q3 and Q4 are connected in series tothe triple gate transistor Q2 in the example of FIG. 5, the transistorsQ3 and Q4 may also be single gate transistors. Although the foregoingembodiments have described the HEMTs as transistors used to compose theswitch circuit, it is also possible to use other FETs such as MESFETs inplace of the HEMTs.

Although the foregoing embodiments have used WSiN as the gate resistorsconnected to the gates of the switch transistors Q1 and Q2, it is alsopossible to form the gate resistors by using a refractory metal having arelatively high sheet resistance other than WSi, a silicide of arefractory metal, or a plurality of stacked layers composed thereof.

Although the description has been given to the case where the presentinvention is applied to a switch circuit suitable for a quad band systemconstructed to be capable of communication in accordance with the fourmodes of the GSM 800, the GSM 850, the DCS 1800, and the PCS 1900 and adual band system constructed to be capable of communication inaccordance with the two modes of the GSM and the DCS and to a module onwhich the switch circuit is mounted together with power amplifiers, thepresent invention is not limited thereto. The present invention is alsoapplicable to a switch circuit used for a system such as a wireless LANwhich transmits and receives signals in, e.g., the 2.4 GHz band and the5 GHz band.

The following is a brief description of effects achievable by therepresentative aspects of the present invention disclosed in the presentapplication.

Specifically, by using a FET in place of a diode as an element composinga switch circuit in accordance with the present invention, the number ofcomponents composing a communication system and a module (electroniccomponent for communication) can be reduced and the mounting density canbe increased. By controlling the resistance values of the gate resistorssuch that they become progressively smaller in a direction from the gateto which a highest voltage is applied toward the gate to which a lowestvoltage is applied, it becomes possible to circumvent the situation inwhich a FET to which a higher voltage is inputted is brought into the ONstate earlier, reduce insertion loss, and reduce harmonic distortion.

By further applying a dc voltage for biasing to each of a transmitterterminal and a terminal connected to an antenna, the maximum permissiblepower of an RF signal inputted to the transmitter terminal can beincreased. As a result, even when a wireless communication system havinga large maximum output power is used, the insertion loss is small andleakage power from a transmitter to a receiver is small in amount sothat harmonic distortion is thereby reduced.

1. An electronic component for communication, comprising: a first poweramplification circuit for amplifying an RF signal in a first frequencyband to be transmitted; a second power amplification circuit foramplifying an RF signal in a second frequency band to be transmitted; afirst terminal connected to a transmission/reception antenna; a secondterminal connected to a first reception circuit for processing areceived RF signal in the first frequency band; a third terminalconnected to a second reception circuit for processing a received RFsignal in the second frequency band; a first switch circuit providedbetween said first terminal and said first power amplification circuitand between said first and second terminals; and a second switch circuitprovided between said first terminal and said second power amplificationcircuit and between said first and third terminals, wherein a transistorconstituting said first switch circuit and a transistor constitutingsaid second switch circuit have respective characteristics differentfrom each other such that an insertion loss of the first switch circuitand an insertion loss of the second switch circuit are balanced.
 2. Anelectronic component for communication according to claim 1, wherein thetransistor constituting said first switch circuit and the transistorconstituting said second switch circuit have the differentcharacteristics which are different in gate widths.
 3. An electroniccomponent for communication according to claim 1, wherein said firstswitch circuit includes first switching means provided between saidfirst terminal and the first power amplification circuit and secondswitching means provided between said first and second terminals,wherein said second switch circuit includes third switching meansprovided between said first terminal and the second power amplificationcircuit and fourth switching means provided between said first and thirdterminals, each of said second and fourth switching means is constitutedby a single multi-gate transistor or a plurality of transistorsconnected in series, respective resistor elements are connected betweena plurality of gate terminals of the transistor or transistors and ancontrol input terminal used commonly thereamong, and resistance valuesof the resistor elements have been set such that the resistor elementconnected to the gate terminal closer to said first terminal has alarger resistance value.
 4. An electronic component for communicationaccording to claim 3, wherein each of the first and third switchingmeans is comprised of the single multi-gate transistor or the pluralityof transistors connected in series, the respective resistor elements areconnected between the plurality of gate terminals of the transistor ortransistors and the control input terminal used commonly thereamong, andthe resistance values of the resistor elements are set such that theresistor element connected to the gate terminal closer to said firstterminal has a smaller resistance value.
 5. An electronic component forcommunication, comprising: a first power amplification circuit foramplifying an RF signal in a first frequency band to be transmitted; asecond power amplification circuit for amplifying an RF signal in asecond frequency band to be transmitted; a first terminal connected to atransmission/reception antenna; a second terminal connected to a firstreception circuit for processing a received RF signal in the firstfrequency band; a third terminal connected to a second reception circuitfor processing a received RF signal in the second frequency band; afirst switch circuit provided between said first terminal and said firstpower amplification circuit and said second terminal; and a secondswitch circuit provided between said first terminal and said secondpower amplification circuit and said third terminal, wherein a frequencyin said second frequency band has been adjusted to be lower than afrequency in said first frequency band, and a first signal line formedbetween said second power amplification circuit and the second switchcircuit to propagate the RF signal to be transmitted has been designedto be longer than a second signal line formed between said first poweramplification circuit and the first switch circuit to propagate the RFsignal to be transmitted.
 6. An electronic component for communication,comprising: a first power amplification circuit for amplifying an RFsignal in a first frequency band to be transmitted; a second poweramplification circuit for amplifying an RF signal in a second frequencyband to be transmitted; a first terminal connected to atransmission/reception antenna; a second terminal connected to a firstreception circuit for processing a received RF signal in the firstfrequency band; a third terminal connected to a second reception circuitfor processing a received RF signal in the second frequency band; afirst switch circuit provided between said first terminal and said firstpower amplification circuit and said second terminal; and a secondswitch circuit provided between said first terminal and said secondpower amplification circuit and said third terminal, wherein a specifieddc voltage is applied via a resistor element to each of a signal inputterminal of said first switch circuit to which the RF signal in saidfirst frequency band to be transmitted is inputted, a signal inputterminal of said second switch circuit to which the RF signal in saidsecond frequency band to be transmitted is inputted, and said firstterminal.
 7. An electronic component for communication according toclaim 6, wherein at least said first and second switch circuits areformed over a single semiconductor chip, and said resistor elementconnected to each of said signal input terminal and said first terminalis connected to a specified terminal of said semiconductor chip outsidethe semiconductor chip.
 8. A semiconductor device for switchingtransmission and reception, comprising: a first terminal connected to atransmission/reception antenna; a second terminal connected to atransmission circuit; a third terminal connected to a reception circuit;first switching means provided between said first and second terminals;and second switching means provided between said first and thirdterminals, said semiconductor device performing switching between asignal to be transmitted and a received signal through an ON/OFFoperation of said first and second switching means, wherein said secondswitching means is comprised of a single multi-gate transistor or aplurality of transistors connected in series, respective resistorelements are connected between a plurality of gate terminals of thetransistor or transistors and a control input terminal used commonlythereamong, and resistance values of the resistor elements are set suchthat the resistor element connected to the gate terminal closer to saidfirst terminal has a larger resistance value.
 9. A semiconductor devicefor switching transmission and reception according to claim 8, whereinsaid first switching means is comprised of a single multi-gatetransistor or a plurality of transistors connected in series, respectiveresistor elements are connected between a plurality of gate terminals ofthe transistor or transistors and a control input terminal used commonlythereamong, and resistance values of the resistor elements are set suchthat the resistor element connected to the gate terminal closer to saidfirst terminal has a larger resistance value.
 10. A semiconductor devicefor switching transmission and reception according to claim 8, whereineach of said resistor elements is constituted by a refractory metallayer or a silicide layer of a refractory metal formed in a specifiedpattern over an insulating film outside a transistor formation region ofa semiconductor substrate formed with said transistor or transistors.11. A semiconductor device for switching transmission and receptionaccording to claim 8, wherein said second switching means is constitutedby the multi-gate transistor and a second transistor connected betweensaid first and third terminals in series relation to said multi-gatetransistor, respective resistor elements are connected between aplurality of gate terminals of said multi-gate transistor and a controlinput terminal used commonly thereamong, and resistance values of theresistor elements are set such that the resistor element connected tothe gate terminal closer to said first terminal has a larger resistancevalue.
 12. A semiconductor device for switching transmission andreception according to claim 8, further comprising: a fourth terminalconnected to a second reception circuit; and third switching meansconnected between said first and fourth terminals, wherein said thirdswitching means is comprised of a single multi-gate transistor or aplurality of transistors connected in series, respective resistorelements are connected between a plurality of gate terminals of thetransistor or transistors and a control input terminal used commonlythereamong, and resistance values of the resistor elements are set suchthat the resistor element connected to the gate terminal closer to saidfirst terminal has a larger resistance value.